No Access Submitted: 27 May 2004 Accepted: 16 August 2004 Published Online: 19 October 2004
Appl. Phys. Lett. 85, 3307 (2004); https://doi.org/10.1063/1.1805712
We present a method for microfabricating apertures in a silicon substrate using well-known cleanroom technologies resulting in highly reproducible giga-seal resistance bilayer formations. Using a plasma etcher, 150μm apertures have been etched through a silicon wafer. Teflon has been chemically vapor deposited so that the surface resembles bulk Teflon and is hydrophobic. After fabrication, reproducible high resistance bilayers were formed and characteristic measurements of a self-inserted single OmpF porin ion channel protein were made.
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